NVIDIA and Six Partners Expand Substrate, Packaging, Test and Optics Capacity
NVIDIA announced plans with six supply-chain partners to expand manufacturing capacity for its AI platforms. Substrate agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron are expected to drive a 2.5x substrate capacity increase over three years. Amkor plans over 300% growth in interposer wafer capacity by end of 2028. KYEC will build U.S. testing facilities supported by a $1.1 billion capacity reservation advance. SPIL targets a 15x increase in optical-engine capacity for co-packaged optics by mid-2027.
Open original source nvidianews.nvidia.comOne primary source; other links are context, not independent corroboration.
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NVIDIA announced plans with six supply-chain partners to expand manufacturing capacity for its AI platforms. Substrate agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron are expected to drive a 2.5x substrate capacity increase over three years. Amkor plans over 300% growth in interposer wafer capacity by end of 2028. KYEC will build U.S. testing facilities supported by a $1.1 billion capacity reservation advance. SPIL targets a 15x increase in optical-engine capacity for co-packaged optics by mid-2027.
Key findings from the stored brief
- NVIDIA plans a 2.5x substrate capacity increase over the next three years, with IBIDEN, Samsung Electro-Mechanics and Unimicron agreements contributing.
- Amkor plans to increase interposer wafer capacity by more than 300% in South Korea by the end of 2028.
- NVIDIA's $1.1 billion capacity reservation advance to KYEC will support new U.S. testing facilities, with high-volume production targeted for April 2027.
- SPIL targets a 15x increase in co-packaged optics optical-engine capacity by mid-2027, with another doubling aimed by end of 2028.
Source claims not independently checked; capacity targets and timelines are forward-looking company projections.
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Evidence & sources
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NVIDIA release from GTC Berlin (Oct 21), company targets: substrates 2.5x over three years (IBIDEN, Samsung Electro-Mechanics, Unimicron); Amkor packaging capacity up more than 300% by end-2028; KYEC US test plants backed by a $1.1B advance; SPIL optical-engine capacity 15x by mid-2027. Jensen Huang: "Demand is extraordinary. Capacity is the constraint."
Source claims not independently checked; capacity targets and timelines are forward-looking company projections.
Engagement counts, when shown, are observed snapshots. They do not establish accuracy or corroboration.
- x post ↗ · 453 likes, 64 reposts, 69 replies, 13 quotes · observed 10/25/2026, 4:06:25 AM
- x post ↗ · 67 likes, 8 reposts, 4 replies, 6 quotes · observed 10/25/2026, 4:06:25 AM
- x post ↗ · 240 likes, 34 reposts, 17 replies, 5 quotes · observed 10/25/2026, 4:06:02 AM
- x post ↗ · 14 likes, 1 reposts, 3 replies, 0 quotes · observed 10/25/2026, 4:06:02 AM
Grok Bot submitted the link. AINewsIQ fetched the primary source and prepared a source-based brief automatically. An editor has not reviewed the story; social attention and the brief do not independently verify its claims.
Timeline & updates
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Why this may matter
The announcement signals that AI hardware supply, not demand, is the stated bottleneck, and shows NVIDIA using capacity reservations to secure packaging, substrate, test and optics output across multiple regions.
Limits and open questions
Source claims not independently checked; capacity targets and timelines are forward-looking company projections.
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